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    HTC Non-silicone Heat Transfer Compound

    2ml – 10ml – 20ml – 35ml – 100ml – 700g – 1K – 25k

    Key Properties:
    • Excellent non-creep characteristics
    • Very high thermal conductivity; 0.9 W/m.K
    • Wide operating temperature -50°C to +130°C
    • Low evaporation weight loss
    • Easy to use and available in aerosol form, HTCA
    • Low toxicity

    HTCA Non-silicone Heat Transfer Compound Aerosol 200ml

    Key Properties:
    • Excellent non-creep characteristics
    • Excellent thermal conductivity even at high temperatures: 0.9 W/m.K
    • Wide operating temperature range -50°C to +130°C
    • Low evaporation weight loss
    • Easy to use and economic, particularly for larger applications

    HTCP Non-Silicone Heat Transfer Compound Plus

    2ml – 20ml – 100ml – 700g – 1k – 25kg

    Key Properties:
    • Excellent non-creep characteristics
    • Very high thermal conductivity; 2.50 W/m.K
    • Wide operating temperature range: -50°C to +130°C
    • Low evaporation weight loss
    • White colour enabled treated parts to be easily identified
    • Low in toxicity

    HTCX Non-Silicone Heat Transfer Compound Xtra

    35ml – 100ml – 700g – 1kg – 12.5kg

    Key Properties:
    • Very low oil bleed and evaporation weight loss
    • Reduced viscosity for ease of application
    • Excellent non-creep characteristics
    • Very wide operating temperature range
    • Excellent thermal conductivity: 1.35 W/m.K
    • Low toxicity

    HTCX_ZF Zinc Free Non-Silicone Heat Transfer Compound 10ml

    Key Properties:
    • High performance – Improved thermal conductivity
    • Excellent Stability
    • Low Oil Bleed
    • Contains no Zinc Oxide
    • Non-curing paste
    • Easy application

    HTS Silicone Heat Transfer Compound

    2ml – 10ml – 35ml – 100ml – 700g – 1Kg- 25Kg – 700g

    Key Properties:
    • Excellent non-creep charactistics
    • Vibration stable, designed for gap filling applications
    • Wide operating temperature range: -50°C to +200°C
    • Thermal conductivity even at high temperatures: 0.90 W/m.K
    • Low in toxicity and economical in use
    • Low evaporation weight loss

    HTSP Silicone Heat Transfer Compound Plus

    35ml – 50ml – 100ml – 830ml – 1Kg – 10Kg – 25Kg

    Key Properties:
    • Superior thermal conductivity even at high temperatures 3.0 W/m.K
    • Excellent non-creep characteristics
    • Wide operating temperature range -50°C to +200°C
    • Low evaporation weight loss

    HTSX Silicone Heat Transfer Compound Xtra

    35ml – 830g

    Key Properties:
    • General purpose silicone thermal paste;
    • Reduced oil-bleed
    • Non-curing thermal paste
    • Excellent stability in a range of conditions
    • Exceptionally wide operating temperature range
    • Excellent thermal conductivity;
    • Allows simple and efficient rework of components if required
    • RoHS Compliant

    ICSF CURVE

    • For wave soldering
    • For spray fluxing
    • For Alcohol based fluxes
    • For water based fluxes
    • For rosin based fluxes

    ICSF CURVE 2

    • For wave soldering
    • For spray fluxing
    • For Alcohol based fluxes
    • For water based fluxes
    • For rosin based fluxes

    ICSF Select

    • For wave soldering
    • For spray fluxing
    • For alcohol based fluxes
    • For water based fluxes
    • For rosin based fluxes

    IF 14 SERIES LEAD-FREE

    • Lead-free solder wire
    • For rework & repair
    • Brushable residue
    • Absolutely halide-free
    • Absolutely colophony free
    • Low residue