LP 5720

  • High stability on the stencil
  • Absolutely halide-free
  • For SnPb(Ag) alloys
  • For Lead-free alloys
  • Transparent post reflow residue

Description

Interflux® LP 5720 is a no-clean solder paste with optimized printing stability and transparent residue after reflow, in lead-free and SnPb(Ag) alloys.
LP 5720 is the successor of DP 5505.
RO L0 to IPC and EN standards.
Halide content 0,00%