LMPA™-Q6

  • Enhanced low melting point solder paste
  • High stability on the stencil
  • Absolutely halide-free
  • Smooth, clear and transparent residue
  • Low voiding
  • Reduced cost of production.
  • Increased mechanical reliability

Description

Interflux® LMPA™-Q6 is a no-clean solder paste with the high reliability LMPA™-Q low melting point alloy.
LMPA™ -Q6 solder paste has improved printing stability, stencil life and more transparent residue compared to DP 5600.
RO L0 to IPC and EN standards.
Halide content 0,00