Description

FIP200 is a Silver/Copper Filled Moisture Cure Cured Form-In-Place material formulated to act as electromagnetic shielding at the joints between casings. Designed for small gasket bead applications (minimum 0.4mm wide x 0.3mm high) such as mobile phones, telecommunication devices, optical modules, and automotive-related applications. The low hardness of FIP200 allows a low sealing force putting less stress on the casing during assembly.