Description

These electronic potting and encapsulation compounds are fast curing two part epoxy resins of low viscosity. ER1450 cures as an opaque white resin, while ER1451 exhibits the same properties but has an optically clear finish.

Both resins exhibit exactly the same physical properties.

They are tough but fast curing systems which show good results through thermal cycling and offering stability in applications with variable temperature while maintaining good electrical properties and a good adhesion to a range of substrates.

The system may be supplied in bulk, kit or resin pack form.