Encapsulation Resins

  • ER2219 Single Component Epoxy Resin

    ER2219 Single Component Epoxy Resin

    35ml – 1Kg

    Key Properties:
    • Single-part black epoxy
    • Semi-thixotropic epoxy;
    • Flame retardant resin
    • High ionic purity; low ionisable chlorine content
    • Quick cure at elevated temperatures;
    • Meets UL94 V-0 Approval
    • RoHS Compliant
  • ER2220 Thermally Conductive Epoxy

    ER2220 Thermally Conductive Epoxy

    250g Resin Pack – 5Kg

    Key Properties:
    • Very high thermal conductivity: 1.54 W/m.K
    • Flame Retardant
    • Utilises non-abrasive fillers
    • Used for encapsulating PCBs or devices requiring effective thermal dissipation
    • Provides environmental protection
    • Wide operating temperature range: -40°C to +130°C