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IF 9009LT
- For reflow soldering
- For stencil printing
- For dispensing
- Lead-free alloys
- SnPb alloys
- Increased activity
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LMPA™-Q6
- Enhanced low melting point solder paste
- High stability on the stencil
- Absolutely halide-free
- Smooth, clear and transparent residue
- Low voiding
- Reduced cost of production.
- Increased mechanical reliability
