Description

Interflux® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications.
Repeatable and selective paste volume
Fast and easy application
Reduced risk of bridging on μ-BGAs
Suitable for the ERSA Dip&Print Station
For Ball Grid Arrays, J-lead and Gull Wing ICs
RO L0 to EN and IPC standards
Halide content: 0,00%