Description
Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Halide content: 0,00%
Sn42Bi57Ag1 (melting point 139°C ~ 282°F)
DP 5600
- For reflow soldering
- For stencil printing
- For dispensing
- Absolutely halide-free
- Low melting temperature
- Low voiding
