Description

Interflux® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M provides.
SnPb and lead-free compatible
Suitable for spray and foam fluxing
OR L0 according to EN and IPC standards
Solid content: 2,5% ±0,3
Halide content: 0,00%